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Alpha® om-6106 ultra-fine pitch solder paste description alpha om-6106, is a low residue, no-clean solder paste designed to maximize smt line throughput and yields. The flux vehicle is rheologically formulated to provide excellent ultra-fine pitch and highspeed printing properties. The alpha om-6106 activation system has been optimized to enhance joint solderability, solderballs and other soldering defects while maintaining long term reliability. Features & benefits  alpha om-6106 is suitable for ultra-fine pitch applications such as 0. 5mm (20 mil) pitch flip-chip and 0201 assembly.   excellent print repeatability to 0. 25mm (10 mil) circles at high print speeds (based upon a 0. 125mm (5 mil) stencil thickness).   excellent response to pause performance, generating less defects due to start up.   uses universally available type 3 powder.   high print speed, up to 200mm/sec (8/sec) and fast release speed to give rapid print cycle times.   low residue level with minimal spread for reliable underfilling processes and results.   excellent solderballing characteristics.   excellent reliability properties, halide-free material. Product information alloys: 62sn/36pb/2ag and 63sn/37pb powder size: type 3, (25-45 mm per ipc j-std-005) packaging sizes: 500 gram jars, 6” and 12” cartridges, dek proflow® cassettes. Flux gel: available in 10cc and 30cc syringes for rework applications. Safety formulated for both standard and fine pitch smt stencil printing with apertures 0-25mm (10 mil) diameter and print speeds up to 200mm/sec (8/sec) with standard stencil thickness of 0. 100mm (4 mil) to 0. 150mm (6 mil), particularly when used in conjunction with alpha stencils. Consult the sds for all safety information. The most recent version of the sds is available from alpha
technical data category results procedures/remarks chemical properties activity level rel-0 = j-std classification (corrosivity cu mirror pass (l)) ipc j-std-004 halide content halide free (by titration). Passes ag chromate test ipc j-std-004 bono testing pass (corrosion and residue) bono testing standard electrical properties sir (ipc 7 days @ 85 c/85% rh) 2. 6 x 109 ohms pass, ipc j-std-004 {pass = 1 x 108 ohm min, uncleaned} sir (bellcore 96 hours @35 c/85% rh) 1. 9 x 1012 ohms pass, bellcore gr78-core {pass = 1 x 1011 ohm min} electromigration (bellcore 500 hours @65 c/85 rh) initial 1. 4 x 109 ohms, final 9. 3 x 109 ohms pass, bellcore gr78-core 62sn/36pb/2ag {pass= final > initial/10} physical properties color clear, colourless flux residue tack force less than 1 g/mm2 change at 25%, 50% and 75% rh ipc j-std-005 viscosity 89. 5% metal load designated m14 for printing applications. Malcom spiral viscometer; j-std-005 coalescence test able to reflow at 170µm circle size in nitrogen process internal coalescence test solder ball pass < 10 count (62sn/36pb/2ag and 63sn/37pb alloy) class 2, 1 hour pass, 72 hour pass ipc j-std-005b tm-650 2. 4. 43 din standard 32 513, 4. 4
 processing guidelines storage & handling
1. Refrigerate to guarantee stability @ 0- 10°c (32-50°f) 2. Shelf life of refrigerated paste is six months. 3. Paste can be stored for 4 weeks at room temperatures up to 25° c (77°f). 4. When refrigerated, warm-up of paste container to room temperature for up to 8 hours. Paste must be  18°c (64°f) before processing. Verify paste temperature is above 18°c (64°f) or greater before setup. Printing can be performed at temperatures up to 28°c (81°f). 5. Do not remove worked paste from stencil and mix with unused paste in jar. This will alter rheology of unused paste. 6. These are starting recommendations and all process settings should be reviewed independently

ALPHA® OM-338 and OM-338T Paste Flux NO-CLEAN REWORK AND BGA FLUX This No-Clean flux is engineered to be used in the placement and reflow of lead-free solders for BGA attach processes. Before reflow, the flux provides sufficient tack to hold the BGA in place. After reflow the residue is clear, colorless. This paste flux can also be used in the rework of components. PHYSICAL, CHEMICAL AND ELECTRICAL PROPERTIES OF FLUX Appearance Smooth, white to off-white paste Viscosity (Spiral/Malcom 10 RPM) Typically 170-300 Poise @ 25°C (5 RPM) Tack strength (per IPC J-STD-004) Initial 6.5 grams / sq mm 6 hr @ 50% RH 6.2 grams / sq mm 24 hr @ 50% RH 6.2 grams / sq mm Fineness of Grind <10 m Acid Number (mg KOH/g) 140-170 Corrosivity Passes IPC Cu mirror, Cu corrosion Halide Content Halide free (ROL0 per IPC J-STD-004) Moisture Content < 1.0 % (w/w) J-STD-004 SIR (pass > 108) 4.2 x 109 Ohms, 1 Day, un-cleaned J-STD-004 SIR (pass > 108) 6.8 x 109 Ohms, 4 Days, un-cleaned J-STD-004 SIR (pass > 108) 8.9 x 109 Ohms, 7 Days, un-cleaned BELLCORE SIR (pass > 1011) 7.3 x 1011 Ohms, 1 Day, un-cleaned BELLCORE SIR (pass > 1011) 3.5 x 1011 Ohms, 4 days, un-cleaned Electromigration (500 hours) 1.6 x 1011 Ohms, 96 hours (BELLCORE) 4.0 x 1011 Ohms, 500 hours (pass: final > init /10) REFLOW Reflow can be accomplished in dry air or nitrogen controlled atmosphere. The initial ramp rate should be 1 - 2C per second. If necessary, a dwell of 1 to 2 minutes at 130 - 160C is acceptable. Following this equilibrating period is a ramp of 60 - 120C to a peak temperature of 235 - 260C depending upon alloy. The time above alloy liquidus (TAL) should be 45 - 90 seconds. Cooling rate should be 3 - 7C per second to room temperature. USE The flux may be applied by screen printing or pin transfer (substrate) or doctor blade / dip coating (package). It can also be dispensed. CLEANING Although designed as a no-clean flux system, the reflowed residue may be cleaned with BIOACT SC-10E, BIOACT SC-30, ALPHA SM-110, ALPHA SM-110E, ALPHA BC-2200, Kyxen Micronox MX2501, and Zestron ATRON® AC205. Production stencils or pin transfer equipment can be cleaned with BIOACT SC10. STORAGE The flux should be stored in sealed containers and need not be refrigerated. Shelf life of unopened containers is 6 months. If the material has been chilled, the container should be allowed to reach room temperature before opening in order to prevent moisture condensation from ambient air onto the flux.  
SAFETY While OM-338 and OM-338T paste flux is not considered toxic, its use in typical reflow processes will generate some decomposition and reaction vapors. These vapors should be adequately exhausted from the work environment and away from personnel. Consult the Material Safety Data Sheet (MSDS) for additional safety information. For the latest MSDS,

ALPHA® OM-340 - NO-CLEAN, LEAD-FREE SOLDER PASTE
FINE FEATURE, ZERO HALOGEN1 , LOW HEAD IN PILLOW DEFECT, HIGHLY PIN TESTABLE 
ALPHA OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-340 provides best in class low defect rate for Head in Pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications. Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, ALPHA OM-340’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability. 1 Zero halogen is defined as no halogen is intentionally added to the formulation.
FEATURES & BENEFITS -
 Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 200μm (8 mil) with 100μm (4 mil) thick stencils  Excellent print consistency with high process capability index across all board designs.  Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput.  Wide reflow profile window with good solderability on various board / component finishes.  Excellent solder and flux cosmetics after reflow soldering  Best in class low defect rate for Head in Pillow  Best in class in circuit pin test yield  Reduction in random solderballing levels, minimizing rework and increasing first time yield  Meets highest IPC 7095 voiding performance classification of Class III  Excellent reliability properties, halide-free material  Compatible with either nitrogen or air reflow  Zero halogen (No halogen intentionally added to the formulation)
 PRODUCT INFORMATION
Alloys: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu) SAC405 (95.5%Sn/4.0%Ag/0.5%Cu) SACX® Plus™ 0307 (99%Sn/0.3%Ag/0.7%Cu) SACX® Plus™ 0807 (98.5%Sn/0.8%Ag/0.7%Cu) Innolot (90.95%Sn/3.8%Ag/0.7%Cu/1.4%Sb/0.15%Ni/3%Bi
Powder Size: Type 3 (25 - 45μm per IPC J-STD-005) Type 4 (20 - 38μm per IPC J-STD-005) Type 5 (15 - 25μm per IPC J-STD-005)
Residues: Approximately 5% by (w/w)
Packaging Sizes: 500 gram jars, 6” & 12” cartridges, DEK ProFlow® cassettes, and 10cc and 30cc dispense syringes
Flux Gel: OM-340 Flux Gel is available in 10cc and 30cc syringes for rework applications.
Lead Free: Complies with RoHS Directive 2002/95/EC.  
APPLICATION
Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec) and 150mm/sec (6”/sec), with stencil thickness of 100μm (4 mil) to 150μm (6 mil), particularly when used with ALPHA® Stencils. Blade pressures should be 0.18-0.27 kg/cm of blade (1.0 -1.5 Ibs/inch), depending upon the print speed. The higher the print speed employed, the higher the blade pressure that is required. The reflow process window will give high soldering yield with good cosmetics and minimized rework.
HALOGEN STATUS ALPHA® OM-340 is a Zero Halogen product and passes the standards

ALPHA DR 96
DROSS REDUCER
ITS AWHITE CRYSTAL POWDER,THE MAJOR FUNCTION OF WHICHIS TO ELIMINATE SOLDER DROSS PRODUCED OVER TIME.IT WORKS BY CHEMICALLY REDUCING DROSS AND SEPARATINGIT IN TO PURE SOLDER.WHICH RETURNS TO THE RESERVOIR AND RESIDUAL MATTER WHICH FLOATS ON THE SURFACE FOR EASY REMOVAL.WITH ITS REMARKABLE PERFORMANCE,UP TO 80% OF THE DROSS COULD BE REUTILIZED. THE FORMULATION OF ALPHA DR96 WILL NOT AFFECT THE SOLDERABILITY OF THE SOLDER ITSELF WITH THE SOLDER BATH OPERATING TEMPRETURE SET AT NO MORE 270 C.