Solder Paste

Product Details:

ALPHA® OM-338 and OM-338T Paste Flux NO-CLEAN REWORK AND BGA FLUX This No-Clean flux is engineered to be used in the placement and reflow of lead-free solders for BGA attach processes. Before reflow, the flux provides sufficient tack to hold the BGA in place. After reflow the residue is clear, colorless. This paste flux can also be used in the rework of components. PHYSICAL, CHEMICAL AND ELECTRICAL PROPERTIES OF FLUX Appearance Smooth, white to off-white paste Viscosity (Spiral/Malcom 10 RPM) Typically 170-300 Poise @ 25°C (5 RPM) Tack strength (per IPC J-STD-004) Initial 6.5 grams / sq mm 6 hr @ 50% RH 6.2 grams / sq mm 24 hr @ 50% RH 6.2 grams / sq mm Fineness of Grind <10 m Acid Number (mg KOH/g) 140-170 Corrosivity Passes IPC Cu mirror, Cu corrosion Halide Content Halide free (ROL0 per IPC J-STD-004) Moisture Content < 1.0 % (w/w) J-STD-004 SIR (pass > 108) 4.2 x 109 Ohms, 1 Day, un-cleaned J-STD-004 SIR (pass > 108) 6.8 x 109 Ohms, 4 Days, un-cleaned J-STD-004 SIR (pass > 108) 8.9 x 109 Ohms, 7 Days, un-cleaned BELLCORE SIR (pass > 1011) 7.3 x 1011 Ohms, 1 Day, un-cleaned BELLCORE SIR (pass > 1011) 3.5 x 1011 Ohms, 4 days, un-cleaned Electromigration (500 hours) 1.6 x 1011 Ohms, 96 hours (BELLCORE) 4.0 x 1011 Ohms, 500 hours (pass: final > init /10) REFLOW Reflow can be accomplished in dry air or nitrogen controlled atmosphere. The initial ramp rate should be 1 - 2C per second. If necessary, a dwell of 1 to 2 minutes at 130 - 160C is acceptable. Following this equilibrating period is a ramp of 60 - 120C to a peak temperature of 235 - 260C depending upon alloy. The time above alloy liquidus (TAL) should be 45 - 90 seconds. Cooling rate should be 3 - 7C per second to room temperature. USE The flux may be applied by screen printing or pin transfer (substrate) or doctor blade / dip coating (package). It can also be dispensed. CLEANING Although designed as a no-clean flux system, the reflowed residue may be cleaned with BIOACT SC-10E, BIOACT SC-30, ALPHA SM-110, ALPHA SM-110E, ALPHA BC-2200, Kyxen Micronox MX2501, and Zestron ATRON® AC205. Production stencils or pin transfer equipment can be cleaned with BIOACT SC10. STORAGE The flux should be stored in sealed containers and need not be refrigerated. Shelf life of unopened containers is 6 months. If the material has been chilled, the container should be allowed to reach room temperature before opening in order to prevent moisture condensation from ambient air onto the flux.  
SAFETY While OM-338 and OM-338T paste flux is not considered toxic, its use in typical reflow processes will generate some decomposition and reaction vapors. These vapors should be adequately exhausted from the work environment and away from personnel. Consult the Material Safety Data Sheet (MSDS) for additional safety information. For the latest MSDS, please visit www.alpha.cooksonelectronics.com

Additional Information:

• Production Capacity: 100 KG
• Delivery Time: 10 DAYS
• Packaging Details: ONE BOX CONTAINS 10 TINS OF 100 GRAMS

Product Details:

ALPHA® OM-338 Series ULTRA FINE FEATURE LEAD-FREE SOLDER PASTE DESCRIPTION ALPHA OM-338 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications. Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, exceptional random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338 is formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA OM-338’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
FEATURES & BENEFITS • Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.010”) with 0.100mm (4mil) stencil thickness. • Excellent print consistency with high process capability index across all board designs. • Print speeds of up to 200mm/sec (8”/sec), enabling a fast print cycle time and a high throughput. • Wide reflow profile window with good solderability on various board / component finishes. • Excellent solder and flux cosmetics after reflow soldering • Reduction in random solderballing levels, minimizing rework and increasing first time yield • Meets highest IPC 7095 voiding performance classification of Class III. • Excellent reliability properties, halide-free material • Compatible with either nitrogen or air reflow PRODUCT INFORMATION Alloys: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu) SAC387 (95.5%Sn/3.8%Ag/0.7%Cu) SAC396 (95.5%Sn/3.9%Ag/0.6%Cu) SAC405 (95.5%Sn/4.0%Ag/0.5%Cu) SACXTM e1 alloys per JESD97 Classification For other alloys, contact your local Cookson Electronics Sales Office. Powder Size: Type 3, (25-45μm per IPC J-STD-005) and Type 4 (20-38μm per IPC J-STD-005) – Residues: Approximately 5% by (w/w) Packaging Sizes: 500 gram jars, 6” & 12” cartridges, DEK ProFlow TM cassettes, and 10cc and 30cc dispense syringes. Flux Gel: OM-338 Flux Gel is available in 10cc and 30cc syringes for rework applications. Lead Free: Complies with RoHS Directive 2002/95/EC.
APPLICATION Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec) and 200mm/sec (8”/sec), with stencil thickness of 0.100mm (0.004”) to 0.150mm (0.006”), particularly when used in conjunction with ALPHA® Stencils. Blade pressures should be 0.16-0.34 kg/cm of blade (0.9 -2Ibs/inch), depending upon the print speed. The higher the print speed employed, the higher the blade pressure that is required. The reflow process window will give high soldering yield with good cosmetics and minimized rework. SAFETY While the ALPHA OM-338 flux system is not considered toxic, its use in typical reflow will generate a small amount of reaction and decomposition vapors. These vapors should be adequately exhausted from the work area. Consult the MSDS for additional safety information. STORAGE ALPHA OM-338 should be stored in a refrigerator upon receipt at 0 to 10°C (32-50°F). ALPHA OM-338 should be permitted to reach room temperature before unsealing its package prior to use (see handling procedures on page 2). This will prevent moisture condensation build up in the solder paste. 

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),D/P
• Port of Dispatch: MUMBAI
• Production Capacity: 1000 KG
• Delivery Time: 20
• Packaging Details: HALF K/G TIN ,10 TINS IN ONE CARTOON

Product Details:

T E C H N I C A L B U L L E T I N
SM895-15 ALPHA® OM-340 - NO-CLEAN, LEAD-FREE SOLDER PASTE FINE FEATURE, ZERO HALOGEN1 , LOW HEAD IN PILLOW DEFECT, HIGHLY PIN TESTABLE DESCRIPTION ALPHA OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-340 provides best in class low defect rate for Head in Pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications. Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, ALPHA OM-340’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability. 1 Zero halogen is defined as no halogen is intentionally added to the formulation FEATURES & BENEFITS  Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 200μm (8 mil) with 100μm (4 mil) thick stencils  Excellent print consistency with high process capability index across all board designs.  Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput.  Wide reflow profile window with good solderability on various board / component finishes.   Excellent solder and flux cosmetics after reflow soldering  Best in class low defect rate for Head in Pillow   Best in class in circuit pin test yield  Reduction in random solderballing levels, minimizing rework and increasing first time yield  Meets highest IPC 7095 voiding performance classification of Class III   Excellent reliability properties, halide-free material   Compatible with either nitrogen or air reflow  Zero halogen (No halogen intentionally added to the formulation) PRODUCT INFORMATION Alloys: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu) SAC405 (95.5%Sn/4.0%Ag/0.5%Cu) SACX® Plus™ 0307 (99%Sn/0.3%Ag/0.7%Cu) SACX® Plus™ 0807 (98.5%Sn/0.8%Ag/0.7%Cu) Innolot (90.95%Sn/3.8%Ag/0.7%Cu/1.4%Sb/0.15%Ni/3%Bi) For other alloys, please contact your local Cookson Electronics Sales Office. Powder Size: Type 3 (25 - 45μm per IPC J-STD-005) Type 4 (20 - 38μm per IPC J-STD-005) Type 5 (15 - 25μm per IPC J-STD-005) Residues: Approximately 5% by (w/w) Packaging Sizes: 500 gram jars, 6” & 12” cartridges, DEK ProFlow® cassettes, and 10cc and 30cc dispense syringes Flux Gel: OM-340 Flux Gel is available in 10cc and 30cc syringes for rework applications. Lead Free: Complies with RoHS Directive 2002/95/EC. 
APPLICATION Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec) and 150mm/sec (6”/sec), with stencil thickness of 100μm (4 mil) to 150μm (6 mil), particularly when used with ALPHA® Stencils. Blade pressures should be 0.18-0.27 kg/cm of blade (1.0 -1.5 Ibs/inch), depending upon the print speed. The higher the print speed employed, the higher the blade pressure that is required. The reflow process window will give high soldering yield with good cosmetics and minimized rework. HALOGEN STATUS ALPHA® OM-340 is a Zero Halogen product and passes the standards listed in the Table below: Halogen Standards Standard Requirement Test Method Status JEITA ET-7304 Definition of Halogen Free Soldering Materials < 1000 ppm Br, Cl, F in solder material solids Pass IEC 612249-2-21 Post Soldering Residues contain < 900 ppm each or total of < 1500 ppm Br 

Additional Information:

• Item Code: ALFAOM340M16
• Production Capacity: 1000 KG
• Delivery Time: ONE WEEK
• Packaging Details: ONE BOX CONTAINS 5 KG ,10 TINS OF 500 GRAMS IN EACH BOX DULY MAINTAINING THE TEMPRETURE KEPT ICE BAGS IN EACH BOX.

Product Details:

• Solder Paste OL107F (SACX0307)[Lead-free Solder Paste for Fine Pitch Printing Application]
• Features: Solder Paste OL107F is a solder paste whose flux system meets the requirements offine pitch printing application.3⁄4 Stable viscosity realizes a long period of continuous printing(>24 hours).It reduces the waste of solder paste.3⁄4 The flux is applicable to paste in holes process. And the appearance of flux residuesis clear.3⁄4 Also printability has been promoted due to its improved rolling property.3⁄4 Solubility has been improved by using a unique activator system. It reduces theoccurrence of solder ball, as well.
• Application: OL107F is formulated for fine pitch stencil application. Tack life is over 24 hours,although it depends on the condition. The following is an example of Specification. Regarding metal content and viscosity, various specifications are available. PleaseContact us for further information on the different specificationApplication Alloy Composition Metal content PowerMesh Size
• Viscosity(+/-40 Pa.s)
• StencilPrinting
• 99Sn/0.3Ag/0.7Cu 88 ~ 90% 400 mesh 200Pa.s
•  Properties of FluxTest Item Results ProcedureFlux TypeCorrosion Test(Flux Residues)Copper Mirror Corrosion TestSilver Chromate Paper TestR0L1No color changed. PassNo copper peeled. PassNo color changed . Pass
• IPC J-STD-004AJIS Z 3284 Appendix 4JIS Z 3197 8.4.2JIS Z 3197 8.1.4.2.3
• Surface Insulation ResistanceMigration TestWetting/DewettingTack Force TestHot SlumpSolder Ball
• >1 × 1012 ohms>1 × 109ohms(@85°C85%RH/48Vdc/1000hrs)Copper Plate : Class 2100gf(@24 hours)No ContactFlocculation Rate:1
• JIS Z 3284 Appendix 3aJIS Z 3284 Appendix 14JIS Z 3284 Appendix 10JIS Z 3284 Appendix 9JIS Z 3284 Appendix 8JIS Z 3284 Appendix 11
• ??? REMOVAL OF RESIDUESCleaning is not necessary since the flux residues exhibit excellent corrosion property and
• have high insulation resistance without cleaning. If necessary, Bioact EC-7 cleaner or EC-7R cleaner is available.
• ??? REFLOW PROFILE ( 5-ZONE Hot-air Reflow oven )
• PROFILEPeak temp : 240+/-5°CReflow Zone : 55+/-5sec180~220°C : 30sec150~200°C : 100+/-5sec45~150°C : 2~3°C/sec
• SACX0307 OL107FPeak : 245°C150 ~ 170°C90sec ~ 120secApprox.1 ~ 3°C/sec
•  HANDLING1. Store in a cool dark place.( @ 0~10°C )2. Set the printer and the dispenser at 23-25°C, and 40 – 60%RH.3. Before use, OL107F should be permitted to reach room temperature.4. Close the lid of the container after work.5. Never use the dry portion of the paste. Remove the dry portion before use.6. OL107F contains no organic solvent corresponding to the rules about pecifiedchemical matters or organic. Nevertheless, avoid fume inhalation or skin contact.7. Consult the Material Safety Data Sheet for additional safety information on thisproduct.
•  PACKAGINGAvailable in 500 gram Plastic Jar

Additional Information:

• Production Capacity: 1000 KG
• Delivery Time: IMMIDIEATE
• Packaging Details: 5 K.G. IN THARMACOL BOX AND THEN CORRUGATED BOX I BOX CONTAINS 5KG SOLDER PASTE WITH COOLING BAGS

Product Details:

Alpha® om-6106 ultra-fine pitch solder paste description alpha om-6106, is a low residue, no-clean solder paste designed to maximize smt line throughput and yields. The flux vehicle is rheologically formulated to provide excellent ultra-fine pitch and highspeed printing properties. The alpha om-6106 activation system has been optimized to enhance joint solderability, solderballs and other soldering defects while maintaining long term reliability. Features & benefits  alpha om-6106 is suitable for ultra-fine pitch applications such as 0. 5mm (20 mil) pitch flip-chip and 0201 assembly.   excellent print repeatability to 0. 25mm (10 mil) circles at high print speeds (based upon a 0. 125mm (5 mil) stencil thickness).   excellent response to pause performance, generating less defects due to start up.   uses universally available type 3 powder.   high print speed, up to 200mm/sec (8/sec) and fast release speed to give rapid print cycle times.   low residue level with minimal spread for reliable underfilling processes and results.   excellent solderballing characteristics.   excellent reliability properties, halide-free material. Product information alloys: 62sn/36pb/2ag and 63sn/37pb powder size: type 3, (25-45 mm per ipc j-std-005) packaging sizes: 500 gram jars, 6” and 12” cartridges, dek proflow® cassettes. Flux gel: available in 10cc and 30cc syringes for rework applications. Safety formulated for both standard and fine pitch smt stencil printing with apertures 0-25mm (10 mil) diameter and print speeds up to 200mm/sec (8/sec) with standard stencil thickness of 0. 100mm (4 mil) to 0. 150mm (6 mil), particularly when used in conjunction with alpha stencils. Consult the sds for all safety information. The most recent version of the sds is available from alpha
technical data category results procedures/remarks chemical properties activity level rel-0 = j-std classification (corrosivity cu mirror pass (l)) ipc j-std-004 halide content halide free (by titration). Passes ag chromate test ipc j-std-004 bono testing pass (corrosion and residue) bono testing standard electrical properties sir (ipc 7 days @ 85 c/85% rh) 2. 6 x 109 ohms pass, ipc j-std-004 {pass = 1 x 108 ohm min, uncleaned} sir (bellcore 96 hours @35 c/85% rh) 1. 9 x 1012 ohms pass, bellcore gr78-core {pass = 1 x 1011 ohm min} electromigration (bellcore 500 hours @65 c/85 rh) initial 1. 4 x 109 ohms, final 9. 3 x 109 ohms pass, bellcore gr78-core 62sn/36pb/2ag {pass= final > initial/10} physical properties color clear, colourless flux residue tack force less than 1 g/mm2 change at 25%, 50% and 75% rh ipc j-std-005 viscosity 89. 5% metal load designated m14 for printing applications. Malcom spiral viscometer; j-std-005 coalescence test able to reflow at 170µm circle size in nitrogen process internal coalescence test solder ball pass < 10 count (62sn/36pb/2ag and 63sn/37pb alloy) class 2, 1 hour pass, 72 hour pass ipc j-std-005b tm-650 2. 4. 43 din standard 32 513, 4. 4
 processing guidelines storage & handling
1. Refrigerate to guarantee stability @ 0- 10°c (32-50°f) 2. Shelf life of refrigerated paste is six months. 3. Paste can be stored for 4 weeks at room temperatures up to 25° c (77°f). 4. When refrigerated, warm-up of paste container to room temperature for up to 8 hours. Paste must be  18°c (64°f) before processing. Verify paste temperature is above 18°c (64°f) or greater before setup. Printing can be performed at temperatures up to 28°c (81°f). 5. Do not remove worked paste from stencil and mix with unused paste in jar. This will alter rheology of unused paste. 6. These are starting recommendations and all process settings should be reviewed independently

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),D/P
• Port of Dispatch: MUMBAI
• Production Capacity: 1000KG
• Delivery Time: 05 DAYS
• Packaging Details: HALF K.G.TIN PACK ,10 TINS IN ONE CARTOON

Product Details:

ALPHA CVP-520Solder Paste

ALPHA CVP-520 is designed to enable low temperature surface mount assembly technology. The lead-free alloy in ALPHA CVP-520 has a melting point below 140°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA CVP-520 is clear, colorless, and provides excellent electrical resistivity, exceeding industry standards. This product enables the elimination of an extra wave or selective wave soldering process when temperature sensitive through hole components are used in an assembly. Eliminating a wave soldering or selective soldering step can significantly lower the cost of producing an electronic assembly, increase daily throughput, eliminate the need for managing bar solder and wave soldering flux supplies and eliminate the need for pallets. 

The carefully selected Sn/Bi/Ag alloy in ALPHA CVP-520 was selected to give the lowest melting point, lowest pasty range during melting and re-solidification, along with a very fine grain structure, offering maximum resistance to thermal cycle based fatigue. The alloy also yields very low voiding BGA solder joints, even when a traditional SAC alloy sphere is used. The use of ALPHA Exactalloy performs may enable the elimination of selective wave soldering by providing additional solder volume when needed. All components used with ALPHA CVP-520 must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC.

Features & Benefits

 

Additional Information:

• Item Code: LEADSOLDERPASTE
• Production Capacity: 1000
• Delivery Time: 10 DAYS
• Packaging Details: 1 BOX OF 5 KG ,10 TINS OF 500 GRAM