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ALPHA® OM-338 and OM-338T Paste Flux NO-CLEAN REWORK AND BGA FLUX This No-Clean flux is engineered to be used in the placement and reflow of lead-free solders for BGA attach processes. Before reflow, the flux provides sufficient tack to hold the BGA in place. After reflow the residue is clear, colorless. This paste flux can also be used in the rework of components. PHYSICAL, CHEMICAL AND ELECTRICAL PROPERTIES OF FLUX Appearance Smooth, white to off-white paste Viscosity (Spiral/Malcom 10 RPM) Typically 170-300 Poise @ 25°C (5 RPM) Tack strength (per IPC J-STD-004) Initial 6.5 grams / sq mm 6 hr @ 50% RH 6.2 grams / sq mm 24 hr @ 50% RH 6.2 grams / sq mm Fineness of Grind <10 m Acid Number (mg KOH/g) 140-170 Corrosivity Passes IPC Cu mirror, Cu corrosion Halide Content Halide free (ROL0 per IPC J-STD-004) Moisture Content < 1.0 % (w/w) J-STD-004 SIR (pass > 108) 4.2 x 109 Ohms, 1 Day, un-cleaned J-STD-004 SIR (pass > 108) 6.8 x 109 Ohms, 4 Days, un-cleaned J-STD-004 SIR (pass > 108) 8.9 x 109 Ohms, 7 Days, un-cleaned BELLCORE SIR (pass > 1011) 7.3 x 1011 Ohms, 1 Day, un-cleaned BELLCORE SIR (pass > 1011) 3.5 x 1011 Ohms, 4 days, un-cleaned Electromigration (500 hours) 1.6 x 1011 Ohms, 96 hours (BELLCORE) 4.0 x 1011 Ohms, 500 hours (pass: final > init /10) REFLOW Reflow can be accomplished in dry air or nitrogen controlled atmosphere. The initial ramp rate should be 1 - 2C per second. If necessary, a dwell of 1 to 2 minutes at 130 - 160C is acceptable. Following this equilibrating period is a ramp of 60 - 120C to a peak temperature of 235 - 260C depending upon alloy. The time above alloy liquidus (TAL) should be 45 - 90 seconds. Cooling rate should be 3 - 7C per second to room temperature. USE The flux may be applied by screen printing or pin transfer (substrate) or doctor blade / dip coating (package). It can also be dispensed. CLEANING Although designed as a no-clean flux system, the reflowed residue may be cleaned with BIOACT SC-10E, BIOACT SC-30, ALPHA SM-110, ALPHA SM-110E, ALPHA BC-2200, Kyxen Micronox MX2501, and Zestron ATRON® AC205. Production stencils or pin transfer equipment can be cleaned with BIOACT SC10. STORAGE The flux should be stored in sealed containers and need not be refrigerated. Shelf life of unopened containers is 6 months. If the material has been chilled, the container should be allowed to reach room temperature before opening in order to prevent moisture condensation from ambient air onto the flux.  
SAFETY While OM-338 and OM-338T paste flux is not considered toxic, its use in typical reflow processes will generate some decomposition and reaction vapors. These vapors should be adequately exhausted from the work environment and away from personnel. Consult the Material Safety Data Sheet (MSDS) for additional safety information. For the latest MSDS,