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Solder Paste

We are a leading Manufacturer of solder paste ( led free ) om338, solder paste 63/37, solder paste cvp 390 and lead free solder paste from Pune, India.

Solder Paste ( LED Free ) OM338

Solder Paste ( LED Free ) OM338
  • Solder Paste ( LED Free ) OM338
  • Solder Paste ( LED Free ) OM338
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Product Details:

Minimum Order Quantity5 Kilogram
Material CompositionLed Free
Material Typeled free solder paste
BrandCookson
ColorGrey
Density (Gram/Centimeter Cube)Gram
Self Life6 to 8 hrs after refrigator
Weight (Gram)half k.g. tin

Property Specification Test Method Flux Classification REL0 JSTD-004Copper Mirror No removal of copper film IPC-TM-650 2.3.32Corrosion Pass IPC-TM-650 2.6.15SIRJSTD-004 2.44 x 1010 ohms IPC-TM-650 2.6.3.3Bellcore (Telecordia) 4.10 x 1010 ohms Bellcore GR-78-CORE 13.1.3Electromigration Pass Bellcore GR-78-CORE 13.1.4Post Reflow Flux Residue 45% TGA Analysis Acid Value 110 IPC-TM-650 2.3.13Metal Loading 88% IPC-TM-650 2.2.20ViscosityBrookfield (1), kcps 400+/-10% kcps IPC-TM-650 2.4.34 modified Malcom (2), poise 850-1100 IPC-TM-650 2.4.34.3 modified Slump Test25 °C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.35150 °C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.3525 °C, 0.33 vertical/horizontal 0.20 /0.20 IPC-TM-650 2.4.35150 °C, 0.33 vertical/horizontal 0.20/0.20 IPC-TM-650 2.4.35Solder Ball Test Pass IPC-TM-650 2.4.43TackInitial 85 gm JIS Z 3284Tack retention @ 24 hr 90 gm JIS Z 3284Tack retention @ 24 hr 82 gm JIS Z 3284Page 2 of 6DispensingNeedle inner Diameter Applicable powder Needle Gauge in. μ m (mesh cut)18 0.033 838 -200+32520 0.023 584 -325+50021 0.02 508 -325+50022 0.016 406 -325+50023 0.013 330 -325+50025 0.01 254 -400+635The clearance gap between the needle and the substrate affects the shape and quality of the dotdispensed. If the clearance is too little, the dot tends to be flattened out, and if too large, the dot tends tohave long tailing.PressureThe pressure applied in the syringe should be kept at a minimum, and the proper head pressure kept inthe range of 15-25 lb/in² (1.05-1.76 kg/cm²). In cases where a paste requires much higher pressure(more than 40 lb/in² or 2.82 kg/cm²) to dispense, the paste will become inconsistent and clogging maybe expected. The external air pressure supply should be maintained constant.Paste Application Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the-paste enough time to come to thermal equilibrium with the environment. The flow rate of paste in dispensing application depends on viscosity, which can be altered by temperature change. If solder pasteis purchased in syringes pre-mixing is not necessary due to the shear action produced from the dispensing.Reflow Best results have been achieved when EGPL-6337 is reflowed in a forced air convection oven witha minimum of 8 zones (top & bottom), however reflow is possible with a 4 zone oven (top &bottom).The following is a recommended profile for a forced air convection reflow process. The melting temperature of the solder, the heat resistance of the components, and the characteristics of the PCB(i.e. density, thickness, etc.) determine the actual reflow profile.
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Additional Information:

  • Pay Mode Terms: T/T (Bank Transfer),D/P
  • Port of Dispatch: MUMBAI
  • Production Capacity: 1000 KG
  • Delivery Time: 20
  • Packaging Details: HALF K/G TIN ,10 TINS IN ONE CARTOON
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Solder Paste 63/37

Solder Paste 63/37
  • Solder Paste 63/37
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Product Details:

Minimum Order Quantity5 Kilogram
Material Composition6337
Material Melting Temperature183 EHardness
Material TypePASTE
Self Life8 To 10 Hrs After Fridger
Weight (Gram)Half K.g.
Melting Point (Degree Celsius)183 EHardness

EGPL-6337 (SN-63, PB-37 , Ag 0.2)No Clean Solder Paste Technical Data Sheet
Description
The EGPL-6337 No Clean Solder Paste is a no clean solder paste designed for surface mount applications using a syringe dispensing method. The post soldering residues of EGPL-6337 arenon-conductive, non-corrosive and highly insulated.

Benefits
  • Low residues
  • Easily dispensed
  • Excellent wettability
  • Hard non-conductive residues
Solder Composition of EGPL-6337 Solder PasteSn63 alloy is the conventional eutectic solder used in most electronic assemblies. The Sn63 alloy conforms and exceeds the impurity requirements of J-STD-006 and all other relevant international standards.Typical Analysis Sn Pb Cu Ag Sb Bi In As Fe Ni Cd62.5- Bal. 0.030 0.020 0.050 0.050 0.050 0.010 0.010 0.005 0.00163.5 Max Max Max Max Max Max Max Max MaxAl Zn Au0.001 0.001 0.002Max Max Max Particle SizeSn63 alloy is 3(45-25μm and J-STD-005 powder distribution. Solder powder distribution is measure dutilizing laser diffraction, optical analysis and sieve analysis. Careful control of solder powder manufacturing processes ensures the particles’ shape are 95% spherical minimum (aspect ratio <1.5) and that the alloy contains a typical maximum oxide level of 80 ppm.Classification of Solder Powder by Particle Size Powder Type Fines Majority Coarse Typical Mesh<10% >80% >90% <1% 0%3 20 25-45 45 50 325/500Metal Loading Typical metal loading for dispensing application is 87.0-88.0 %.PropertiesEGPL-6337 Sn63/Pb37/0.2Melting Point, °C 183 EHardness, Brinell 14HBCoefficient of Thermal Expansion 24.7Tensile Strength, psi 4442Density, g/cc 8.42Electrical Resistivity , (μohm- cm) 14.5Electrical Conductivity, 104/ohm-cm 6.9Yield Strength, psi 3950Total Elongation,% 48Joint Shear Strength, at 0.1mm/min 20 °C 23Joint Shear Strength, at 0.1mm/min 100 °C 14Creep Strength, N/mm2 at 0.1mm/min 20 °C 3.3Property Specification Test MethodFlux Classification REL0 JSTD-004Copper Mirror No removal of copper film IPC-TM-650 2.3.32Corrosion Pass IPC-TM-650 2.6.15SIRJSTD-004 2.44 x 1010 ohms IPC-TM-650 2.6.3.3Bellcore (Telecordia) 4.10 x 1010 ohms Bellcore GR-78-CORE 13.1.3Electromigration Pass Bellcore GR-78-CORE 13.1.4Post Reflow Flux Residue 45% TGA Analysis Acid Value 110 IPC-TM-650 2.3.13Metal Loading 88% IPC-TM-650 2.2.20ViscosityBrookfield (1), kcps 400+/-10% kcps IPC-TM-650 2.4.34 modified Malcom (2), poise 850-1100 IPC-TM-650 2.4.34.3 modified Slump Test25 °C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.35150 °C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.3525 °C, 0.33 vertical/horizontal 0.20 /0.20 IPC-TM-650 2.4.35150 °C, 0.33 vertical/horizontal 0.20/0.20 IPC-TM-650 2.4.35Solder Ball Test Pass IPC-TM-650 2.4.43TackInitial 85 gm JIS Z 3284Tack retention @ 24 hr 90 gm JIS Z 3284Tack retention @ 24 hr 82 gm JIS Z 3284DispensingNeedle inner Diameter Applicable powder Needle Gauge in. μ m (mesh cut)18 0.033 838 -200+32520 0.023 584 -325+50021 0.02 508 -325+50022 0.016 406 -325+50023 0.013 330 -325+50025 0.01 254 -400+635The clearance gap between the needle and the substrate affects the shape and quality of the dot dispensed. If the clearance is too little, the dot tends to be flattened out, and if too large, the dot tends to have long tailing.Pressure The pressure applied in the syringe should be kept at a minimum, and the proper head pressure kept inthe range of 15-25 lb/in² (1.05-1.76 kg/cm²). In cases where a paste requires much higher pressure(more than 40 lb/in² or 2.82 kg/cm²) to dispense, the paste will become inconsistent and clogging maybe expected. The external air pressure supply should be maintained constant.Paste Application Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the
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Additional Information:

  • Pay Mode Terms: T/T (Bank Transfer),D/P
  • Port of Dispatch: MUMBAI
  • Production Capacity: 1000KG
  • Delivery Time: 20 DAYS
  • Packaging Details: HALF K.G.TIN PACK ,10 TINS IN ONE CARTOON
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Solder Paste CVP 390

Solder Paste CVP 390
  • Solder Paste CVP 390
  • Solder Paste CVP 390
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Product Details:

Minimum Order Quantity5 Unit
Net Weight500 gram
BrandALFA NO CLEAN
ColorGREY
Material CompositionSn-99% Ag-0.3%,Cu-0.7%
Material TypePASTE
Weight.500

Solder Paste OL107F (SACX0307)[Lead-free Solder Paste for Fine Pitch Printing Application]
¿¿¿ FEATURESSolder Paste OL107F is a solder paste whose flux system meets the requirements offine pitch printing application.3⁄4 Stable viscosity realizes a long period of continuous printing(>24 hours).It reduces the waste of solder paste.3⁄4 The flux is applicable to paste in holes process. And the appearance of flux residuesis clear.3⁄4 Also printability has been promoted due to its improved rolling property.3⁄4 Solubility has been improved by using a unique activator system. It reduces theoccurrence of solder ball, as well.
¿¿¿ APPLICATIONOL107F is formulated for fine pitch stencil application. Tack life is over 24 hours,although it depends on the condition. The following is an example of specification.Regarding metal content and viscosity, various specifications are available. PleaseContact us for further information on the different specificationApplication Alloy Composition Metal content PowerMesh Size
Viscosity(+/-40 Pa.s)
StencilPrinting
99Sn/0.3Ag/0.7Cu 88 ~ 90% 400 mesh 200Pa.s
¿¿¿ Properties of FluxTest Item Results ProcedureFlux TypeCorrosion Test(Flux Residues)Copper Mirror Corrosion TestSilver Chromate Paper TestR0L1No color changed. PassNo copper peeled. PassNo color changed . Pass
IPC J-STD-004AJIS Z 3284 Appendix 4JIS Z 3197 8.4.2JIS Z 3197 8.1.4.2.3
Surface Insulation ResistanceMigration TestWetting/DewettingTack Force TestHot SlumpSolder Ball
>1 × 1012 ohms>1 × 109ohms(@85°C85%RH/48Vdc/1000hrs)Copper Plate : Class 2100gf(@24 hours)No ContactFlocculation Rate:1
JIS Z 3284 Appendix 3aJIS Z 3284 Appendix 14JIS Z 3284 Appendix 10JIS Z 3284 Appendix 9JIS Z 3284 Appendix 8JIS Z 3284 Appendix 11
¿¿¿ REMOVAL OF RESIDUESCleaning is not necessary since the flux residues exhibit excellent corrosion property and
have high insulation resistance without cleaning. If necessary, Bioact EC-7 cleaner or EC-7R cleaner is available.
¿¿¿ REFLOW PROFILE ( 5-ZONE Hot-air Reflow oven )
PROFILEPeak temp : 240+/-5°CReflow Zone : 55+/-5sec180~220°C : 30sec150~200°C : 100+/-5sec45~150°C : 2~3°C/sec
SACX0307 OL107FPeak : 245°C150 ~ 170°C90sec ~ 120secApprox.1 ~ 3°C/sec
¿¿¿ HANDLING1. Store in a cool dark place.( @ 0~10°C )2. Set the printer and the dispenser at 23-25°C, and 40 – 60%RH.3. Before use, OL107F should be permitted to reach room temperature.4. Close the lid of the container after work.5. Never use the dry portion of the paste. Remove the dry portion before use.6. OL107F contains no organic solvent corresponding to the rules about pecifiedchemical matters or organic. Nevertheless, avoid fume inhalation or skin contact.7. Consult the Material Safety Data Sheet for additional safety information on thisproduct.
¿¿¿ PACKAGINGAvailable in 500 gram Plastic Jar
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  • Delivery Time: IMMIDIEATE
  • Packaging Details: 5 K.G. IN THARMACOL BOX AND THEN CORRUGATED BOX
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Lead Free Solder Paste

Lead Free Solder Paste
  • Lead Free Solder Paste
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Product Details:

Minimum Order Quantity10 Kilogram
Material Typepaste
BrandCookson
ApplicationP C B
Viscosity5-30Pa.S(10rpm, 25deg, 2min)
Solids Content by Weight60+-5%

Materials and Substances:

  • The table below references Level A and B Materials and Substances indicated in the Joint Industry Guide – Material Composition Declaration Guide September 19th 2003. This includes the materials defined in Article 4 .1 of the European Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS Directive).
  • The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or impliedregarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use ofany materials designated.

Other Details:

Material/SubstanceThreshold LevelMaterial/Substance Concentration
AsbestosIntentionally addedNot Intentionally Added
Azo colorantsIntentionally addedNot Intentionally Added
Cadmium/Cadmium Compounds **100ppm or Intentionally addedLess than Threshold Level and
Not Intentionally Added
Hexavalent Chromium/ Hexavalent Chromium Compounds **1000ppm or Intentionally addedLess than Threshold Level and
Not Intentionally Added
Lead/Lead Compounds **1000ppm or Intentionally addedLess than Threshold Level and
Not Intentionally Added
Mercury/Mercury Compounds **1000ppm or Intentionally addedLess than Threshold Level and
Not Intentionally Added
Ozone Depleting Substances (CFCs, HCFCs, HBFCs, carbon tetrachloride etc.)Class I : Intentionally added
Class II : HCFCs : 1000ppm
Less than Threshold Level and
Not Intentionally Added
Polybrominated Biphenyls (PBBs) **1000ppm or Intentionally addedLess than Threshold Level and
Not Intentionally Added
Polybrominated Biphenylethers (PBDEs) **1000ppm or Intentionally addedLess than Threshold Level and
Not Intentionally Added

RoHS Regulated Substance:
  • Source data used for Declaration:
  • Third party analysis of actual product
  • Subject matter expert assessment
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Additional Information:

  • Pay Mode Terms: T/T (Bank Transfer),D/P
  • Port of Dispatch: MUMBAI
  • Production Capacity: 100 TON
  • Delivery Time: immidieate
  • Packaging Details: 5 K G BOX
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