Solder Paste

ALPHA® OM-338 Series ULTRA FINE FEATURE LEAD-FREE SOLDER PASTE DESCRIPTION ALPHA OM-338 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-338’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications. Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, exceptional random solder ball resistance and mid-chip solder ball performance. ALPHA OM-338 is formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA OM-338’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
FEATURES & BENEFITS • Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.010”) with 0.100mm (4mil) stencil thickness. • Excellent print consistency with high process capability index across all board designs. • Print speeds of up to 200mm/sec (8”/sec), enabling a fast print cycle time and a high throughput. • Wide reflow profile window with good solderability on various board / component finishes. • Excellent solder and flux cosmetics after reflow soldering • Reduction in random solderballing levels, minimizing rework and increasing first time yield • Meets highest IPC 7095 voiding performance classification of Class III. • Excellent reliability properties, halide-free material • Compatible with either nitrogen or air reflow PRODUCT INFORMATION Alloys: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu) SAC387 (95.5%Sn/3.8%Ag/0.7%Cu) SAC396 (95.5%Sn/3.9%Ag/0.6%Cu) SAC405 (95.5%Sn/4.0%Ag/0.5%Cu) SACXTM e1 alloys per JESD97 Classification For other alloys, contact your local Cookson Electronics Sales Office. Powder Size: Type 3, (25-45μm per IPC J-STD-005) and Type 4 (20-38μm per IPC J-STD-005) – Residues: Approximately 5% by (w/w) Packaging Sizes: 500 gram jars, 6” & 12” cartridges, DEK ProFlow TM cassettes, and 10cc and 30cc dispense syringes. Flux Gel: OM-338 Flux Gel is available in 10cc and 30cc syringes for rework applications. Lead Free: Complies with RoHS Directive 2002/95/EC.
APPLICATION Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec) and 200mm/sec (8”/sec), with stencil thickness of 0.100mm (0.004”) to 0.150mm (0.006”), particularly when used in conjunction with ALPHA® Stencils. Blade pressures should be 0.16-0.34 kg/cm of blade (0.9 -2Ibs/inch), depending upon the print speed. The higher the print speed employed, the higher the blade pressure that is required. The reflow process window will give high soldering yield with good cosmetics and minimized rework. SAFETY While the ALPHA OM-338 flux system is not considered toxic, its use in typical reflow will generate a small amount of reaction and decomposition vapors. These vapors should be adequately exhausted from the work area. Consult the MSDS for additional safety information. STORAGE ALPHA OM-338 should be stored in a refrigerator upon receipt at 0 to 10°C (32-50°F). ALPHA OM-338 should be permitted to reach room temperature before unsealing its package prior to use (see handling procedures on page 2). This will prevent moisture condensation build up in the solder paste. 

T E C H N I C A L B U L L E T I N
SM895-15 ALPHA® OM-340 - NO-CLEAN, LEAD-FREE SOLDER PASTE FINE FEATURE, ZERO HALOGEN1 , LOW HEAD IN PILLOW DEFECT, HIGHLY PIN TESTABLE DESCRIPTION ALPHA OM-340 is a lead-free, no-clean solder paste designed for a broad range of applications. ALPHA OM-340 provides best in class low defect rate for Head in Pillow defects combined with excellent first pass yield on ICT/pin testing. ALPHA OM-340 also yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications. Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, ALPHA OM-340’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability. 1 Zero halogen is defined as no halogen is intentionally added to the formulation FEATURES & BENEFITS  Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 200μm (8 mil) with 100μm (4 mil) thick stencils  Excellent print consistency with high process capability index across all board designs.  Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput.  Wide reflow profile window with good solderability on various board / component finishes.   Excellent solder and flux cosmetics after reflow soldering  Best in class low defect rate for Head in Pillow   Best in class in circuit pin test yield  Reduction in random solderballing levels, minimizing rework and increasing first time yield  Meets highest IPC 7095 voiding performance classification of Class III   Excellent reliability properties, halide-free material   Compatible with either nitrogen or air reflow  Zero halogen (No halogen intentionally added to the formulation) PRODUCT INFORMATION Alloys: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu) SAC405 (95.5%Sn/4.0%Ag/0.5%Cu) SACX® Plus™ 0307 (99%Sn/0.3%Ag/0.7%Cu) SACX® Plus™ 0807 (98.5%Sn/0.8%Ag/0.7%Cu) Innolot (90.95%Sn/3.8%Ag/0.7%Cu/1.4%Sb/0.15%Ni/3%Bi) For other alloys, please contact your local Cookson Electronics Sales Office. Powder Size: Type 3 (25 - 45μm per IPC J-STD-005) Type 4 (20 - 38μm per IPC J-STD-005) Type 5 (15 - 25μm per IPC J-STD-005) Residues: Approximately 5% by (w/w) Packaging Sizes: 500 gram jars, 6” & 12” cartridges, DEK ProFlow® cassettes, and 10cc and 30cc dispense syringes Flux Gel: OM-340 Flux Gel is available in 10cc and 30cc syringes for rework applications. Lead Free: Complies with RoHS Directive 2002/95/EC. 
APPLICATION Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec) and 150mm/sec (6”/sec), with stencil thickness of 100μm (4 mil) to 150μm (6 mil), particularly when used with ALPHA® Stencils. Blade pressures should be 0.18-0.27 kg/cm of blade (1.0 -1.5 Ibs/inch), depending upon the print speed. The higher the print speed employed, the higher the blade pressure that is required. The reflow process window will give high soldering yield with good cosmetics and minimized rework. HALOGEN STATUS ALPHA® OM-340 is a Zero Halogen product and passes the standards listed in the Table below: Halogen Standards Standard Requirement Test Method Status JEITA ET-7304 Definition of Halogen Free Soldering Materials < 1000 ppm Br, Cl, F in solder material solids Pass IEC 612249-2-21 Post Soldering Residues contain < 900 ppm each or total of < 1500 ppm Br