Solder Paste

Product Details:

Property Specification Test Method Flux Classification REL0 JSTD-004Copper Mirror No removal of copper film IPC-TM-650 2.3.32Corrosion Pass IPC-TM-650 2.6.15SIRJSTD-004 2.44 x 1010 ohms IPC-TM-650 2.6.3.3Bellcore (Telecordia) 4.10 x 1010 ohms Bellcore GR-78-CORE 13.1.3Electromigration Pass Bellcore GR-78-CORE 13.1.4Post Reflow Flux Residue 45% TGA Analysis Acid Value 110 IPC-TM-650 2.3.13Metal Loading 88% IPC-TM-650 2.2.20ViscosityBrookfield (1), kcps 400+/-10% kcps IPC-TM-650 2.4.34 modified Malcom (2), poise 850-1100 IPC-TM-650 2.4.34.3 modified Slump Test25 °C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.35150 °C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.3525 °C, 0.33 vertical/horizontal 0.20 /0.20 IPC-TM-650 2.4.35150 °C, 0.33 vertical/horizontal 0.20/0.20 IPC-TM-650 2.4.35Solder Ball Test Pass IPC-TM-650 2.4.43TackInitial 85 gm JIS Z 3284Tack retention @ 24 hr 90 gm JIS Z 3284Tack retention @ 24 hr 82 gm JIS Z 3284Page 2 of 6DispensingNeedle inner Diameter Applicable powder Needle Gauge in. μ m (mesh cut)18 0.033 838 -200+32520 0.023 584 -325+50021 0.02 508 -325+50022 0.016 406 -325+50023 0.013 330 -325+50025 0.01 254 -400+635The clearance gap between the needle and the substrate affects the shape and quality of the dotdispensed. If the clearance is too little, the dot tends to be flattened out, and if too large, the dot tends tohave long tailing.PressureThe pressure applied in the syringe should be kept at a minimum, and the proper head pressure kept inthe range of 15-25 lb/in² (1.05-1.76 kg/cm²). In cases where a paste requires much higher pressure(more than 40 lb/in² or 2.82 kg/cm²) to dispense, the paste will become inconsistent and clogging maybe expected. The external air pressure supply should be maintained constant.Paste Application Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the-paste enough time to come to thermal equilibrium with the environment. The flow rate of paste in dispensing application depends on viscosity, which can be altered by temperature change. If solder pasteis purchased in syringes pre-mixing is not necessary due to the shear action produced from the dispensing.Reflow Best results have been achieved when EGPL-6337 is reflowed in a forced air convection oven witha minimum of 8 zones (top & bottom), however reflow is possible with a 4 zone oven (top &bottom).The following is a recommended profile for a forced air convection reflow process. The melting temperature of the solder, the heat resistance of the components, and the characteristics of the PCB(i.e. density, thickness, etc.) determine the actual reflow profile.

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Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),D/P
• Port of Dispatch: MUMBAI
• Production Capacity: 1000 KG
• Delivery Time: 20
• Packaging Details: HALF K/G TIN ,10 TINS IN ONE CARTOON

Product Details:

EGPL-6337 (SN-63, PB-37 , Ag 0.2)No Clean Solder Paste Technical Data Sheet
Description
The EGPL-6337 No Clean Solder Paste is a no clean solder paste designed for surface mount applications using a syringe dispensing method. The post soldering residues of EGPL-6337 arenon-conductive, non-corrosive and highly insulated.

Benefits

• Low residues
• Easily dispensed
• Excellent wettability
• Hard non-conductive residues

Solder Composition of EGPL-6337 Solder PasteSn63 alloy is the conventional eutectic solder used in most electronic assemblies. The Sn63 alloy conforms and exceeds the impurity requirements of J-STD-006 and all other relevant international standards.Typical Analysis Sn Pb Cu Ag Sb Bi In As Fe Ni Cd62.5- Bal. 0.030 0.020 0.050 0.050 0.050 0.010 0.010 0.005 0.00163.5 Max Max Max Max Max Max Max Max MaxAl Zn Au0.001 0.001 0.002Max Max Max Particle SizeSn63 alloy is 3(45-25μm and J-STD-005 powder distribution. Solder powder distribution is measure dutilizing laser diffraction, optical analysis and sieve analysis. Careful control of solder powder manufacturing processes ensures the particles’ shape are 95% spherical minimum (aspect ratio <1.5) and that the alloy contains a typical maximum oxide level of 80 ppm.Classification of Solder Powder by Particle Size Powder Type Fines Majority Coarse Typical Mesh<10% >80% >90% <1% 0%3 20 25-45 45 50 325/500Metal Loading Typical metal loading for dispensing application is 87.0-88.0 %.PropertiesEGPL-6337 Sn63/Pb37/0.2Melting Point, °C 183 EHardness, Brinell 14HBCoefficient of Thermal Expansion 24.7Tensile Strength, psi 4442Density, g/cc 8.42Electrical Resistivity , (μohm- cm) 14.5Electrical Conductivity, 104/ohm-cm 6.9Yield Strength, psi 3950Total Elongation,% 48Joint Shear Strength, at 0.1mm/min 20 °C 23Joint Shear Strength, at 0.1mm/min 100 °C 14Creep Strength, N/mm2 at 0.1mm/min 20 °C 3.3Property Specification Test MethodFlux Classification REL0 JSTD-004Copper Mirror No removal of copper film IPC-TM-650 2.3.32Corrosion Pass IPC-TM-650 2.6.15SIRJSTD-004 2.44 x 1010 ohms IPC-TM-650 2.6.3.3Bellcore (Telecordia) 4.10 x 1010 ohms Bellcore GR-78-CORE 13.1.3Electromigration Pass Bellcore GR-78-CORE 13.1.4Post Reflow Flux Residue 45% TGA Analysis Acid Value 110 IPC-TM-650 2.3.13Metal Loading 88% IPC-TM-650 2.2.20ViscosityBrookfield (1), kcps 400+/-10% kcps IPC-TM-650 2.4.34 modified Malcom (2), poise 850-1100 IPC-TM-650 2.4.34.3 modified Slump Test25 °C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.35150 °C, 0.63 vertical/horizontal No bridges all spacings IPC-TM-650 2.4.3525 °C, 0.33 vertical/horizontal 0.20 /0.20 IPC-TM-650 2.4.35150 °C, 0.33 vertical/horizontal 0.20/0.20 IPC-TM-650 2.4.35Solder Ball Test Pass IPC-TM-650 2.4.43TackInitial 85 gm JIS Z 3284Tack retention @ 24 hr 90 gm JIS Z 3284Tack retention @ 24 hr 82 gm JIS Z 3284DispensingNeedle inner Diameter Applicable powder Needle Gauge in. μ m (mesh cut)18 0.033 838 -200+32520 0.023 584 -325+50021 0.02 508 -325+50022 0.016 406 -325+50023 0.013 330 -325+50025 0.01 254 -400+635The clearance gap between the needle and the substrate affects the shape and quality of the dot dispensed. If the clearance is too little, the dot tends to be flattened out, and if too large, the dot tends to have long tailing.Pressure The pressure applied in the syringe should be kept at a minimum, and the proper head pressure kept inthe range of 15-25 lb/in² (1.05-1.76 kg/cm²). In cases where a paste requires much higher pressure(more than 40 lb/in² or 2.82 kg/cm²) to dispense, the paste will become inconsistent and clogging maybe expected. The external air pressure supply should be maintained constant.Paste Application Solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the

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Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),D/P
• Port of Dispatch: MUMBAI
• Production Capacity: 1000KG
• Delivery Time: 20 DAYS
• Packaging Details: HALF K.G.TIN PACK ,10 TINS IN ONE CARTOON

Product Details:

Materials and Substances:

• The table below references Level A and B Materials and Substances indicated in the Joint Industry Guide – Material Composition Declaration Guide September 19th 2003. This includes the materials defined in Article 4 .1 of the European Directive 2002/95/EC on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS Directive).

• The information contained herein is based on data considered accurate and is offered at no charge. No warranty is expressed or impliedregarding the accuracy of this data. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use ofany materials designated.

Other Details:


RoHS Regulated Substance:

• Source data used for Declaration:
• Third party analysis of actual product
• Subject matter expert assessment

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Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),D/P
• Port of Dispatch: MUMBAI
• Production Capacity: 100 TON
• Delivery Time: immidieate
• Packaging Details: 5 K G BOX