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Alpha® om-6106 ultra-fine pitch solder paste description alpha om-6106, is a low residue, no-clean solder paste designed to maximize smt line throughput and yields. The flux vehicle is rheologically formulated to provide excellent ultra-fine pitch and highspeed printing properties. The alpha om-6106 activation system has been optimized to enhance joint solderability, solderballs and other soldering defects while maintaining long term reliability. Features & benefits  alpha om-6106 is suitable for ultra-fine pitch applications such as 0. 5mm (20 mil) pitch flip-chip and 0201 assembly.   excellent print repeatability to 0. 25mm (10 mil) circles at high print speeds (based upon a 0. 125mm (5 mil) stencil thickness).   excellent response to pause performance, generating less defects due to start up.   uses universally available type 3 powder.   high print speed, up to 200mm/sec (8/sec) and fast release speed to give rapid print cycle times.   low residue level with minimal spread for reliable underfilling processes and results.   excellent solderballing characteristics.   excellent reliability properties, halide-free material. Product information alloys: 62sn/36pb/2ag and 63sn/37pb powder size: type 3, (25-45 mm per ipc j-std-005) packaging sizes: 500 gram jars, 6” and 12” cartridges, dek proflow® cassettes. Flux gel: available in 10cc and 30cc syringes for rework applications. Safety formulated for both standard and fine pitch smt stencil printing with apertures 0-25mm (10 mil) diameter and print speeds up to 200mm/sec (8/sec) with standard stencil thickness of 0. 100mm (4 mil) to 0. 150mm (6 mil), particularly when used in conjunction with alpha stencils. Consult the sds for all safety information. The most recent version of the sds is available from alpha
technical data category results procedures/remarks chemical properties activity level rel-0 = j-std classification (corrosivity cu mirror pass (l)) ipc j-std-004 halide content halide free (by titration). Passes ag chromate test ipc j-std-004 bono testing pass (corrosion and residue) bono testing standard electrical properties sir (ipc 7 days @ 85 c/85% rh) 2. 6 x 109 ohms pass, ipc j-std-004 {pass = 1 x 108 ohm min, uncleaned} sir (bellcore 96 hours @35 c/85% rh) 1. 9 x 1012 ohms pass, bellcore gr78-core {pass = 1 x 1011 ohm min} electromigration (bellcore 500 hours @65 c/85 rh) initial 1. 4 x 109 ohms, final 9. 3 x 109 ohms pass, bellcore gr78-core 62sn/36pb/2ag {pass= final > initial/10} physical properties color clear, colourless flux residue tack force less than 1 g/mm2 change at 25%, 50% and 75% rh ipc j-std-005 viscosity 89. 5% metal load designated m14 for printing applications. Malcom spiral viscometer; j-std-005 coalescence test able to reflow at 170µm circle size in nitrogen process internal coalescence test solder ball pass < 10 count (62sn/36pb/2ag and 63sn/37pb alloy) class 2, 1 hour pass, 72 hour pass ipc j-std-005b tm-650 2. 4. 43 din standard 32 513, 4. 4
 processing guidelines storage & handling
1. Refrigerate to guarantee stability @ 0- 10°c (32-50°f) 2. Shelf life of refrigerated paste is six months. 3. Paste can be stored for 4 weeks at room temperatures up to 25° c (77°f). 4. When refrigerated, warm-up of paste container to room temperature for up to 8 hours. Paste must be  18°c (64°f) before processing. Verify paste temperature is above 18°c (64°f) or greater before setup. Printing can be performed at temperatures up to 28°c (81°f). 5. Do not remove worked paste from stencil and mix with unused paste in jar. This will alter rheology of unused paste. 6. These are starting recommendations and all process settings should be reviewed independently

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),D/P
• Port of Dispatch: MUMBAI
• Production Capacity: 1000KG
• Delivery Time: 05 DAYS
• Packaging Details: HALF K.G.TIN PACK ,10 TINS IN ONE CARTOON

Property Specification: Test method flux classification rel0 jstd-004copper mirror no removal of copper film ipc-tm-650 2.3.32corrosion pass ipc-tm-650 2.6.15sirjstd-004 2.44 x 1010 ohms ipc-tm-650 2.6.3.3bellcore (telecordia) 4.10 x 1010 ohms bellcore gr-78-core 13.1.3electromigration pass bellcore gr-78-core 13.1.4post reflow flux residue 45% tga analysis acid value 110 ipc-tm-650 2.3.13metal loading 88% ipc-tm-650 2.2.20viscositybrookfield (1), kcps 400+/-10% kcps ipc-tm-650 2.4.34 modified malcom (2), poise 850-1100 ipc-tm-650 2.4.34.3 modified slump test25 °c, 0.63 vertical/horizontal no bridges all spacings ipc-tm-650 2.4.35150 °c, 0.63 vertical/horizontal no bridges all spacings ipc-tm-650 2.4.3525 °c, 0.33 vertical/horizontal 0.20 /0.20 ipc-tm-650 2.4.35150 °c, 0.33 vertical/horizontal 0.20/0.20 ipc-tm-650 2.4.35solder ball test pass ipc-tm-650 2.4.43tackinitial 85 gm jis z 3284tack retention @ 24 hr 90 gm jis z 3284tack retention @ 24 hr 82 gm jis z 3284page 2 of 6dispensingneedle inner diameter applicable powder needle gauge in. Μ m (mesh cut)18 0.033 838 -200+32520 0.023 584 -325+50021 0.02 508 -325+50022 0.016 406 -325+50023 0.013 330 -325+50025 0.01 254 -400+635the clearance gap between the needle and the substrate affects the shape and quality of the dotdispensed. If the clearance is too little, the dot tends to be flattened out, and if too large, the dot tends tohave long tailing.Pressurethe pressure applied in the syringe should be kept at a minimum, and the proper head pressure kept inthe range of 15-25 lb/in² (1.05-1.76 kg/cm²). In cases where a paste requires much higher pressure(more than 40 lb/in² or 2.82 kg/cm²) to dispense, the paste will become inconsistent and clogging maybe expected. The external air pressure supply should be maintained constant. Paste application solder paste should be taken out of the refrigerator at least 3 to 6 hours prior to use. This will give the-paste enough time to come to thermal equilibrium with the environment. The flow rate of paste in dispensing application depends on viscosity, which can be altered by temperature change. If solder pasteis purchased in syringes pre-mixing is not necessary due to the shear action produced from the dispensing. Reflow best results have been achieved when egpl-6337 is reflowed in a forced air convection oven witha minimum of 8 zones (top & bottom), however reflow is possible with a 4 zone oven (top & bottom). The following is a recommended profile for a forced air convection reflow process. The melting temperature of the solder, the heat resistance of the components, and the characteristics of the pcb (I.E. Density, thickness, etc.) determine the actual reflow profile.

Additional Information:

• Pay Mode Terms: T/T (Bank Transfer),D/P
• Port of Dispatch: MUMBAI
• Production Capacity: 1000 KG
• Delivery Time: 20
• Packaging Details: HALF K/G TIN ,10 TINS IN ONE CARTOON

• Solder Paste OL107F (SACX0307)[Lead-free Solder Paste for Fine Pitch Printing Application]
• Features: Solder Paste OL107F is a solder paste whose flux system meets the requirements offine pitch printing application.3⁄4 Stable viscosity realizes a long period of continuous printing(>24 hours).It reduces the waste of solder paste.3⁄4 The flux is applicable to paste in holes process. And the appearance of flux residuesis clear.3⁄4 Also printability has been promoted due to its improved rolling property.3⁄4 Solubility has been improved by using a unique activator system. It reduces theoccurrence of solder ball, as well.
• Application: OL107F is formulated for fine pitch stencil application. Tack life is over 24 hours,although it depends on the condition. The following is an example of Specification. Regarding metal content and viscosity, various specifications are available. PleaseContact us for further information on the different specificationApplication Alloy Composition Metal content PowerMesh Size
• Viscosity(+/-40 Pa.s)
• StencilPrinting
• 99Sn/0.3Ag/0.7Cu 88 ~ 90% 400 mesh 200Pa.s
• ??? Properties of FluxTest Item Results ProcedureFlux TypeCorrosion Test(Flux Residues)Copper Mirror Corrosion TestSilver Chromate Paper TestR0L1No color changed. PassNo copper peeled. PassNo color changed . Pass
• IPC J-STD-004AJIS Z 3284 Appendix 4JIS Z 3197 8.4.2JIS Z 3197 8.1.4.2.3
• Surface Insulation ResistanceMigration TestWetting/DewettingTack Force TestHot SlumpSolder Ball
• >1 × 1012 ohms>1 × 109ohms(@85°C85%RH/48Vdc/1000hrs)Copper Plate : Class 2100gf(@24 hours)No ContactFlocculation Rate:1
• JIS Z 3284 Appendix 3aJIS Z 3284 Appendix 14JIS Z 3284 Appendix 10JIS Z 3284 Appendix 9JIS Z 3284 Appendix 8JIS Z 3284 Appendix 11
• ??? REMOVAL OF RESIDUESCleaning is not necessary since the flux residues exhibit excellent corrosion property and
• have high insulation resistance without cleaning. If necessary, Bioact EC-7 cleaner or EC-7R cleaner is available.
• ??? REFLOW PROFILE ( 5-ZONE Hot-air Reflow oven )
• PROFILEPeak temp : 240+/-5°CReflow Zone : 55+/-5sec180~220°C : 30sec150~200°C : 100+/-5sec45~150°C : 2~3°C/sec
• SACX0307 OL107FPeak : 245°C150 ~ 170°C90sec ~ 120secApprox.1 ~ 3°C/sec
• ??? HANDLING1. Store in a cool dark place.( @ 0~10°C )2. Set the printer and the dispenser at 23-25°C, and 40 – 60%RH.3. Before use, OL107F should be permitted to reach room temperature.4. Close the lid of the container after work.5. Never use the dry portion of the paste. Remove the dry portion before use.6. OL107F contains no organic solvent corresponding to the rules about pecifiedchemical matters or organic. Nevertheless, avoid fume inhalation or skin contact.7. Consult the Material Safety Data Sheet for additional safety information on thisproduct.
• ??? PACKAGINGAvailable in 500 gram Plastic Jar

Additional Information:

• Production Capacity: 1000 KG
• Delivery Time: IMMIDIEATE
• Packaging Details: 5 K.G. IN THARMACOL BOX AND THEN CORRUGATED BOX I BOX CONTAINS 5KG SOLDER PASTE WITH COOLING BAGS

ALPHA CVP-520Solder Paste

ALPHA CVP-520 is designed to enable low temperature surface mount assembly technology. The lead-free alloy in ALPHA CVP-520 has a melting point below 140°C, and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA CVP-520 is clear, colorless, and provides excellent electrical resistivity, exceeding industry standards. This product enables the elimination of an extra wave or selective wave soldering process when temperature sensitive through hole components are used in an assembly. Eliminating a wave soldering or selective soldering step can significantly lower the cost of producing an electronic assembly, increase daily throughput, eliminate the need for managing bar solder and wave soldering flux supplies and eliminate the need for pallets. 

The carefully selected Sn/Bi/Ag alloy in ALPHA CVP-520 was selected to give the lowest melting point, lowest pasty range during melting and re-solidification, along with a very fine grain structure, offering maximum resistance to thermal cycle based fatigue. The alloy also yields very low voiding BGA solder joints, even when a traditional SAC alloy sphere is used. The use of ALPHA Exactalloy performs may enable the elimination of selective wave soldering by providing additional solder volume when needed. All components used with ALPHA CVP-520 must be lead-free to eliminate the formation of tin/lead/bismuth intermetallic which has a melting point under 100ºC.

Features & Benefits

 

Additional Information:

• Item Code: LEADSOLDERPASTE
• Production Capacity: 1000
• Delivery Time: 10 DAYS
• Packaging Details: 1 BOX OF 5 KG ,10 TINS OF 500 GRAM